Devices and methods for handling microelectronics assemblies

ABSTRACT

The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

BACKGROUND OF THE INVENTION

This application is a continuation-in-part of U.S. application Ser. No.12/252,292 filed on Oct. 15, 2008. This application further claimspriority under 35 U.S.C. §119(e) of U.S. provisional application Ser.No. 61/194,450 filed Sep. 25, 2008.

1. Field of the Disclosure

The present disclosure relates to devices and methods for handlingmicroelectronic assemblies. In particular, the present disclosure isrelated to devices, such as trays, and methods for handling packagedmicroelectronic devices or assemblies, non-packaged microelectronicdevices or assemblies, or image sensor devices or assemblies.

2. Description of the Prior Art

Typically, trays can be used to reduce damage to microelectronicassemblies, such as memory device and microprocessors, and to increasethe efficiencies in handling and shipping microelectronic assemblies.The Joint Electron Device Engineering Council (JEDEC) has promulgateddesign requirements to standardize trays used by the microelectronicassembly manufacturers and customers. For example, JEDEC Publication 95,Design Guide 4.10, “Generic Shipping & Handling Matrix Tray”,standardizes the physical and functional characteristics of the trays,including the length width, thickness, capacity, stackability, and othercharacteristics of the trays.

SUMMARY AND OBJECTS OF THE INVENTION

It is therefore an object of the present invention to provide animprovement in the trays for storing and transporting computer chips, orother microelectronic assemblies, increasing the efficiency of thehandling and shipping thereof.

It is therefore a further object of the present invention to provide atray within JEDEC standards with respect to outer stacking railstandards.

These and other objectives are attained by providing a tray with aseries of channels, each typically formed along the width of the tray.Each channel includes elements, typically pins and clips, for securing athermoformed tape therewithin. The tape includes thermoformed pocketsfor containing the computer chips, or other microelectronic assemblies.A tape on the lower side of an upwardly adjacent tray can be providedwithout pockets in order to capture the computer chip more effectively.In this manner, different sizes and shapes of computer chips can beaccommodated by the same tray, merely by changing some or all of thethermoformed tapes included therein.

The resulting tray has many uses, including transporting new design,technology, or function devices within the semiconductor market.Further, the resulting tray meets needs developed in the prototype phaseof product introduction with subsequent high volume requirements met byhard-tooled trays and production volumes of tape.

BRIEF DESCRIPTION OF THE DRAWINGS

Further objects and advantages of the invention will become apparentfrom the following description and from the accompanying drawing,wherein:

FIG. 1 is an exploded perspective view of a handling device formicroelectronic assemblies in accordance with an embodiment of thedisclosure.

FIG. 2 is a cross-sectional view illustrating a secured configurationand a released configuration of an insert panel with respect to aportion of the frame for the handling device shown in FIG. 1.

FIG. 3 shows a perspective view of a handling device for microelectronicassemblies in accordance with another embodiment of the disclosure.

FIG. 4 is a perspective view of a frame for the handling device shown inFIG. 3.

FIG. 5 is a perspective view of a handling device carryingmicroelectronic assemblies in accordance with yet another embodiment ofthe disclosure.

FIG. 6 is an enlarged view of a portion of a handling device formicroelectronic assemblies in accordance with a further embodiment ofthe disclosure.

FIG. 7 is an exploded perspective view of a handling device formicroelectronic assemblies in accordance with yet a further embodimentof the disclosure.

FIG. 8 is a top plan view of a still further embodiment of the handlingdevice of the present disclosure.

FIG. 9 is a bottom plan view of the still further embodiment of thehandling device of the present disclosure.

FIG. 10 is a top perspective exploded view of two stacked handlingdevice of the still further embodiment of the present disclosure,including computer chips contained therewithin.

FIG. 11 is a bottom perspective exploded view of two stacked handlingdevices of the still further embodiment of the present disclosure,including computer chips contained therewithin.

FIG. 12 is a side plan view of the still further embodiment of thehandling device of the present disclosure.

FIG. 13 is an end plan view of the still further embodiment of thehandling device of the present disclosure.

FIG. 14 is a perspective view of a corner of the still furtherembodiment of the handling device of the present disclosure, showing theuse of a tape to hold computer chips.

FIG. 15 is an alternative bottom view of the still further embodiment ofthe handling device of the present disclosure.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Specific details of several embodiments of the disclosure are describedbelow with reference to microelectronic assembly handling devices andmethods for handling microelectronic assemblies. As it is used in thepresent disclosure, the phrase “microelectronic assemblies” can includepackaged microelectronic assemblies or devices, bare dies and othernon-packaged microelectronic assemblies or devices, image sensorassemblies and devices, or other semiconductor components. Packagedmicroelectronic assemblies can include, for example, micromechanicalcomponents, data storage elements, optics, read/write components, orother features. Non-packaged microelectronic assemblies can include, forexample, microelectronic dies for flash memory (e.g., NAND flashmemory), SRAM, DRAM (e.g., DDR-SDRAM), processors, imagers, and othertypes of devices. The term “handling” can include a manual or automatedmethod or process by which something is moved, carried, transported,delivered, shipped, worked-on, or otherwise manipulated in connectionwith microelectronic assemblies. The phrase “coupled” can include aphysical association or structural linking of two or more components orfeatures. Other embodiments according to the disclosure can haveconfigurations, components, features or procedures different than thosedescribed in this section. A person of ordinary skill in the relevantart, therefore, will accordingly understand that the disclosure may haveother embodiments with additional elements, or the disclosure may haveother embodiments without several of the elements shown and describedbelow with reference to FIGS. 1-15.

FIG. 1 is an exploded perspective view of a handling device 100 formicroelectronic assemblies in accordance with an embodiment of thedisclosure. The handling device 100 can include a frame 200, an insert(e.g., an insert panel) 300, and one or more retainers 400 thatreleasably secure the frame 200 and the insert panel 300.

In the embodiment shown in FIG. 1, the frame 200 has a rectangular shapeand size in accordance with JEDEC design requirements. According toother embodiments, a frame can have other suitable shapes and/or sizes.The frame 200 includes a first end portion 202 a and a second endportion 202 b. The second end portion 202 b is spaced along alongitudinal axis A1 from the first end portion 202 a. The frame 200also includes a first side portion 204 a and a second side portion 204b. The second side portion 204 b is spaced along a lateral axis A2 fromthe first side portion 204 a. The first and second end portions 202 aand 202 b and the first and second side portions 204 a and 204 b definea platform 210 positioned around an aperture 206 to support the insertpanel 300, and the frame 200 also includes a rim 220 that projects fromthe platform 210 to position the insert panel 300 on the platform 210.

Embodiments of the frame 200 are configured to be formed as a unitaryconstruction of a homogeneous material. For example, the frame 200,including the first and second end portions 202 a and 202 b, the firstand second side portions 204 a and 204 b, and the rim 220, can beinjection molded of carbon fiber or another material having suitableresistivity/conductivity and static dissipative properties. In otherembodiments, other suitable methods and materials can be used to formthe frame 200 as a unitary construction of a homogeneous material. Instill further embodiments of the present disclosure, a frame can includemultiple pieces, possibly of diverse materials, that are assembled toform an integral construction.

The insert panel 300 includes a plurality of pockets 310. Individualpockets 310 are configured to releasably receive a respectivemicroelectronic assembly (not shown in FIG. 1). According to otherembodiments of the present disclosure, the pockets 310 can be configuredto receive other microelectronic components, e.g., bare chips or waferportions. The plurality of pockets 310 can be distributed over theinsert panel 300 in a plurality of rows and in a plurality of columns.As shown in FIG. 1, individual rows extend parallel to the longitudinalaxis A1 and individual columns extend parallel to the lateral axis A2.In other embodiments of the present disclosure, the pockets 310 can haveany suitable distribution over the insert panel 300 that is incompliance with JEDEC Design Guide 4.10, for example.

The insert panel 300 can be thermoformed in particular embodiments ofthe disclosure. As it is used in the present disclosure, the term“thermoform” includes a manufacturing process wherein a thermoplasticsheet or film is heated to its forming temperature before beingstretched into or onto a mold and then cooled. Examples of thermoformingin accordance with the present disclosure can include vacuum forming,pressure forming, or a combination thereof. The insert panel 300 caninclude any suitable thermoplastic material, including tri-laminatepolystyrene. According to other embodiments of the present disclosure,the plurality of pockets 310 can be formed by stamping, machining, e.g.,stereolithography, or any other suitable process.

The insert panel 300 includes a central region 320 and a peripheralregion 340. The central region 320 includes the pockets 310 and theperipheral region 340 overlies the platform 210. The peripheral region340 can include a plurality of holes 360 through which the retainers 400extend so as to secure the insert panel 300 to the frame 200.

Continuing to refer to FIG. 1, the retainers 400 are used to releasablysecure the insert panel 300 to the frame 200. The retainers 400 can bechanged between a coupled arrangement (not shown in FIG. 1) and adecoupled arrangement. In the coupled arrangement, the retainers 400secure the insert panel 300 to the frame 200 so as to prohibit or atleast restrict relative movement between the frame 200 and the insertpanel 300. In the decoupled arrangement shown in FIG. 1, the retainers400 allow the insert plate 300 to be released from the frame 200 so asto permit relative movement, e.g., separation, between the frame 200 andthe insert plate 300.

In the embodiment shown in FIG. 1, the retainers 400 can includethreaded fasteners, e.g., screws or bolts, which pass through the holes360 in the peripheral region 340 of the insert panel 300 and threadablyengage with threaded receptacles 212 in the frame 200. In otherembodiments according to the present disclosure, the retainers 400 caninclude clips, adhesive, threaded posts, projections carried by theframe 200, or any other suitable releasable fastener. In still otherembodiments according to the present disclosure, the insert panel 300can be retained with respect to the frame 200 without separatefasteners, e.g., via a releasable friction fit between the insert panel300 and the frame 200. In such a case, the retainer can include matingfeatures, e.g., contact surfaces on the frame 200 and the insert panel300. In still further embodiments, the frame 200 and the insert panel300 can be connected via other techniques, e.g., welding.

FIG. 2 is a cross-sectional view illustrating a secured configuration(solid lines) and a released configuration (broken lines) of the insertpanel 300 with respect to a portion of the frame 200 in accordance withan embodiment of the present disclosure. In the secured configuration,the peripheral region 340 of the insert panel 300 overlies the platform210 of the frame 200. The rim 220 of the frame 200 positions the insertpanel 300 on the platform 210 so that the holes 360 are approximatelyaligned with the threaded receptacles 212. The insert panel 300 isdisposed across the aperture 206 and the pockets 310 project into theaperture 206. In the embodiment shown in FIG. 2, an individual threadedretainer 400 passes through an individual hole 360 in the insert panel300 and threadably engages an individual threaded receptacle 212. In thereleased configuration, the individual threaded retainer 400 iswithdrawn from the individual threaded receptacle 212 and the insertpanel 300 can be separated from the frame 200 in a release direction R.

The insert panel 300, which includes 112 pockets 310 as shown in FIG. 1,can be released from the frame 200 of the handling device 100, and adifferent insert panel (not shown) can be secured to the frame 200 inits place. The insert plate 300 can be released from the frame 200, forexample, when the retainers 400 are in the decoupled arrangement, and adifferent insert panel can be secured to the frame 200 by repositioningthe retainers 400 in the coupled arrangement. Accordingly, the handlingdevice 100 can facilitate using multiple types of insert panels withdifferent numbers, sizes and distributions of pockets, all supported bythe same frame 200.

FIG. 3 shows a microelectronic assembly handling device 1100 configuredin accordance with another embodiment of the disclosure. In thisembodiment, the handling device 1100 includes a frame 1200 that ispopulated with a different insert than is shown in FIG. 1, e.g., eightinsert strips 1300. A ninth insert strip 1300 is shown spaced above theframe 1200 and enlarged for explanatory purposes.

Individual insert strips 1300 include a central region 1302 and two sideregions 1304. The central region 1302 includes a plurality of pockets1310 that can be configured to receive respective microelectronicassemblies. The insert strips 1300 can be lengths of embossed carriertape, for which the Electronics Industries Alliance (EIA) haspromulgated standards. For example, Standard EIA-481-B, “8 mm through200 mm Embossed Carrier Taping and 8 mm & 12 mm Punched Carrier Tapingof Surface Mounted Components for Automatic Handling,” providesdimensions and tolerances necessary to tape surface mount componentssuch that they may be automatically handled. In the embodiment shown inFIG. 3, a single column of five pockets 1310 is disposed along anindividual insert strip 1300. In other embodiments, the shape, size,capacity and other characteristics of the insert strips 1300 can bedifferent.

The peripheral regions 1304 extend parallel to a lengthwise direction L1of the insert strips 1300 and are disposed laterally outside of thepockets 1310 on either side of an individual insert strip 1300. A set ofholes 1306 can be disposed in individual peripheral regions 1304.

The insert strips 1300, similar to the insert panel 300 described above,can be thermoformed. Accordingly, the foregoing examples ofthermoforming in accordance with the present disclosure (vacuum forming,pressure forming, or a combination thereof) can be used to form theinsert strips 1300. The insert strips 1300 can include any suitablethermoplastic material, including tri-laminate polystyrene. According toother embodiments of the present disclosure, the plurality of pockets1310 can be formed by stamping, machining, e.g., stereolithography, oranother suitable process.

FIG. 4 shows the frame 1200 of the handling device 1100 that is shown inFIG. 3, with the insert strips 1300 removed. According to the embodimentshown in FIG. 4, the frame 1200 has a rectangular shape and size inaccordance with JEDEC design requirements. According to otherembodiments, the frame can have other suitable shapes and/or sizes. Theframe 1200 includes ledges 1210 to support peripheral regions 1304 ofthe insert strips 1300 and includes a rim 1220 for positioning theinsert strips 1300 on the frame 1200.

The ledges 1210 of the frame 1200 can be spaced along a longitudinalaxis A1 and extend parallel to a lateral axis A2. In the embodimentshown in FIG. 4, there are 18 ledges 1210 (only four are indicated inFIG. 4 for the sake of clarity) so as to correspond to the number ofperipheral regions 1304 for nine insert strips 1300. The outerrectangular shape of the frame 1200 is interiorly partitioned by eightpairs of the ledges 1210, and each of the eight interior pairs of theledges 1210 is separated by a respective rib 1222 (only one is indicatedin FIG. 4 for the sake of clarity). The rim 1220 and the ribs 1222position individual insert strips 1300 on the frame 1200. The spacingalong the longitudinal axis A1 between adjacent ones of the rim 1220 andthe ribs 1222 corresponds to a width of individual insert strips 1300,i.e., measured transversely to the lengthwise direction L of the insertstrips 1300. According to other embodiments, different numbers of ledgesand ribs can be disposed interiorly of a rectangular frame toaccommodate different numbers and/or widths of insert strips.

The frame 1210 can also include tabs 1230 that can project parallel tothe longitudinal axis A1. The tabs 1230 (only four are indicated in FIG.4 for the sake of clarity) project from the rim 1220 and the ribs 1222to define gaps 1232 between the tabs 1230 and respective ledges 1210.The gaps 1232 are configured to receive the peripheral regions 1304 ofindividual insert strips 1300. In other embodiments according to thepresent disclosure, any suitable structure other than the tabs 1230 canbe used to prevent or at least restrict separation of individual insertstrips 1300 from the frame 1200. Posts 1212 can project from the ledges1210 for registering, e.g., locating, the insert strips 1300 withrespect to the frame 1200. In the embodiment shown in FIG. 4, the tabs1230 can prevent or at least restrict the insert strips 1300 fromseparating from the frame 1200 and the posts 1212 can prevent or atleast restrict the insert strips 1300 from sliding on the frame 1200. Inother embodiments of the present disclosure, the insert strips 1300 canbe pressed onto several of the posts 1210 such that the insert strips1300 are retained with respect to the frame 1210 via a friction fitwithout the tabs 1230.

In the embodiment shown in FIG. 4, the frame 1200 can include a grid1240 that can underlie the ledges 1210 relative to the tabs 1230. Thegrid 1240 can contiguously support the bottom surfaces of the pockets1310 of the insert strips 1300. According to other embodiments, anysuitable structure other than the grid 1240 can be used to providesupport for pockets.

The frame 1200, similar to the frame 200 described above, can be formedas a unitary construction of a homogeneous material. For example, theframe 1200, including the ledges 1210, the posts 1212, the rim 1220, theribs 1222, the tabs 1230 and the grid portion 1240 can be injectionmolded of carbon fiber or another material having suitableresistivity/conductivity and static dissipative properties. In otherembodiments, other suitable methods and materials can be used to formthe frame 1200 as a unitary construction of a homogeneous material. Instill further embodiments of the present disclosure, a frame can includemultiple pieces, possibly of diverse materials, that are assembled toform an integral construction.

FIG. 5 shows another embodiment according to the present disclosure thatincludes insert strips 2300 supported by the same frame 1200 andmicroelectronic assemblies M (only two are indicated in FIG. 5 for thesake of clarity) disposed in individual pockets 1310. In the embodimentshown in FIG. 5, 14-pocket insert strips 2300 have been secured to theframe 1200 in place of the five-pocket insert strips 1300 shown in FIG.3. In particular, individual insert strips 1300 that include fivepockets 1310, as shown in FIG. 3, have been released from the frame1200, and individual insert strips 2300 that include 14 pockets, asshown in FIG. 5, have been secured to the frame 1200. Accordingly, thenumber, size, and other characteristics of pockets included in an insetstrip can be varied to accommodate various microelectronic assembliesand/or components while the same frame can be used to support thedifferent insert strips.

FIG. 6 is an enlarged view of a portion of a handling device similar tothat shown in FIG. 3, with eight-pocket (rather than five-pocket) insertstrips 3300 installed. With reference to FIG. 6, a method by whichinsert strips can be secured and released, thereby facilitating changinginsert strips while still using the same frame, will now be described.To secure individual insert strips 3300 to the frame 1200, the insertstrip 3300 can be displaced in the direction parallel to the lateralaxis A2 between the ledges 1210 and the tabs 1230 so as to dispose sideregions 3304 of the insert strip 3300 in the gaps 1232. At least onehole 3306 in the insert strip 3300 can then be pressed over a post 1212to secure the insert strip 3300 on the frame 1200. To release an insertstrip 3300 from the frame 1200, the insert strip 3300 is displaced,e.g., lifted, such that the posts 1212 no longer engage holes 3306 inthe insert strip 3300 and the insert strip 3300 is displaced in itslengthwise direction so as to extricate side regions of the insert stripfrom the gaps 1232. According to other embodiments, insert strips withdifferent numbers, sizes, distributions, or other characteristics ofpockets can all be installed on the same frame 1200.

FIG. 7 is an exploded, schematic illustration of a microelectronicassembly handling device 4100 configured in accordance with anembodiment of the disclosure. In this embodiment, the handling device4100 includes a frame 4200, an insert plate 4300, and one or moreretainers 4400. In particular, the insert plate 4300 includes aperipheral region 4302 sandwiched between first and second sections 4208a and 4208 b of the frame 4200, and the retainers 4400 releasably securetogether the first and second sections 4208 a and 4208 b of the frame200 with the insert plate 4300 sandwiched between.

FIGS. 8 and 9 are top and bottom plan views, respectively, of anembodiment of the tray or handling device 10 of the present disclosure.Tray or handling device 10 is configured and arranged for the storageand transportation of non-packaged microelectronic devices, which may bereferred to collectively as the computer chips 250 illustrated in FIG.10. Tray 10 is of a generally rectangular shape, typically in accordancewith JEDEC standards with respect to outer stacking rail standards, witha frame formed by relatively longer first and second sides 12, 16 (seeFIG. 12) and relatively shorter first and second ends 14, 18 (see FIG.13). Extended lips 20, 22 are formed on first and second ends 14, 18thereby providing handles for manually or automatedly moving the tray10.

The profiles of the first and second sides 12, 16 and the first andsecond ends 14, 18, are typically in accordance with the JEDEC standardswith respect to outer stacking rail standards in order to provide forthe stacking ability evidenced by FIGS. 10 and 11. Eight internal rails24-31 extend between first and second sides 12, 16 thereby forming nineupper storage channels 32-40 on the upper surface, and in the embodimentshown in FIG. 9, further forms nine lower storage channels 41-49. Upperstorage channels 32-40 are divided from lower storage channels 41-49 bylattice floor segments 50-58, respectively.

Upper ledge 60 is formed along the interior surfaces of first and secondends 14, 18 as well as on the lateral surfaces of internal rails 24-31on the upper surface as shown in FIG. 8. Similarly, lower ledge 62 isformed along the interior surfaces of first and second ends 14, 18 aswell as on the lateral surfaces of internal rails 24-31 on the bottomsurface as shown in FIG. 9. As shown in FIGS. 10 and 14, upper ledge 60is used to support and position the periphery of upper thermoformedinsert strips 100 while similarly, as shown in FIG. 11, lower ledge 62is used to support and position the periphery of lower thermoformedinsert strips 102 (insert strips 100, 102 may also be referred to as“tapes”). Upper pins 64 are formed on the upper ledge 60, on theinterior surfaces of first and second ends 14, 18 as well as on bothlateral surfaces of internal rails 24-31 inwardly adjacent from thefirst and second sides 12, 16. As shown in FIG. 10 and in further detailin FIG. 14, upper pins 64 engage the lateral sprocket apertures 104 ofupper thermoformed insert strips 100 thereby positioning upperthermoformed insert strips 100 into upper storage channels 32-40. Upperthermoformed insert strips 100 further include pockets 106 forcontaining the various computer chips 250. The pockets 106 of upperthermoformed insert strips 100 can be provided in various dimensions toaccommodate various sizes of computer chips 250. In other embodiments ofthe present disclosure, the pockets 106 can have any suitabledistribution over the upper thermoformed insert strip 100 that is incompliance with JEDEC Design Guide 4.10, for example. Similarly, lowerpins 66 are formed on the lower ledge 62, on the interior surfaces offirst and second ends 14, 18 as well as on both lateral surfaces ofinternal rails 24-31 immediately inwardly adjacent from the first andsecond sides 12, 16. As shown in FIG. 11, lower pins 66 engage lateralsprocket apertures 108 of lower thermoformed insert strips 102 therebypositioning lower thermoformed insert strips 102 into lower storagechannels 41-49. Lower thermoformed insert strip 102 is shown without anypockets thereby acting as a cover for the pockets 106 of an upperthermoformed insert strip 100 of an immediately lower tray 10′ when inthe stacked configuration as shown in FIGS. 10 and 11. However, someembodiments may include pockets within lower thermoformed insert strip102. Furthermore, to assure that the computer chips 250 remain securelyin place in the pockets 106, some embodiments or applications may placea foam strip or similar material (not shown) between the lowerthermoformed insert strip 102 of a tray 10 and the upper thermoformedinsert strip 100 of an immediately lower stacked tray 10′.

While the illustrated embodiment discloses nine upper storage channels32-40 and nine lower storage channels 41-49, other embodiments mayinclude different numbers of storage channels. For instance, while anembodiment employing thermoformed insert strips with a width of 32 mm.may have nine upper storage channels and nine lower storage channels (asillustrated), an embodiment employing thermoformed insert strips with awidth of 24 mm. may have ten upper storage channels and ten lowerstorage channels. Similarly, an embodiment employing thermoformed insertstrips with a width of 44 mm. may have eight upper storage channels andeight lower storage channels. Each thermoformed insert strip may have acenterline position for the computer chips which does not necessarilycorrespond to the highest chip density possible, but rather to a commonchip density achieved by the largest possible chip density achieved bythe largest possible chip fitting into that tape width. The center lineposition for that largest possible chip in the given tape width becomesthe standard center line position for the given tape width. This is doneso that a single set of testing hardware may be utilized for each tapewidth/tray system thereby saving set up time and test head expenses.

Furthermore, it can be seen that lower pins 66 are preferably offsetfrom the corresponding position of upper pins 64. That is, lower pins 66are more closely adjacent to first and second sides 12, 16 than areupper pins 64. This allows for the stacking of trays 10 as shown inFIGS. 10 and 11 without the upper and lower pins 64, 66 of adjacenttrays interfering with each other.

Further, to maintain the upper and lower thermoformed insert strips 100,102 in position, upper and lower clips 68, 70 are formed in spacedrelation with respect to respective upper and lower ledges 60, 62 on theinterior surfaces of ends 14, 18 as well as along the extent of bothlateral surfaces of internal rails 24-31. As can be seen in FIG. 14, theupper clips 68 (and similarly lower clips 70) on ends 14, 18 protrudefrom the interior side of walls 14, 18 immediately above ledge 60 inorder to form a space therebetween to engage upper thermoformed insertstrip 100. However, the upper clips 68 (and similarly lower clips 70)formed on the lateral surfaces of internal rails 24-31 include stand-offfingers 72 to space the upper clips 68 from ledge 60 thereby creating aspace therebetween to engage upper thermoformed insert strip 100.Additionally, while not shown in the figures, it is envisioned that insome embodiments, upper clips 68 may be offset from lower clips 70(i.e., closer or further away from sides 12, 16) in order to prevent theupper and lower clips 70 of adjacent stacked trays from interfering witheach other.

FIG. 15 discloses an alternative embodiment of the bottom of tray 10. Inthis alternative embodiment, the lower pins 66 and lower clips 70 areomitted (some vestiges may remain in place where the lower clips 70would otherwise be formed) with a further view to omitting lowerthermoformed insert strip 102. The bottom of the tray 10 can serve as acover to the upper thermoformed insert strip 100 of an immediately loweradjacent stacked tray 10′.

In order to use tray 10, upper and lower thermoformed insert strips 100,102 are placed into any or all of the upper and lower storage channels32-40 and 41-49 (typically chosen so that the upper and thermoformedinsert strips 100, 102 of adjacent stacked trays will abut each other)in a plurality of trays 10 so that the upper and lower pins 64, 66engage the appropriate lateral sprocket apertures 104, 108 of upper andlower thermoformed insert strips 100, 102 and upper and lower clips 68,70 engage the upper and lower thermoformed insert strips 100, 102against the respective upper and lower ledges 60, 62. Computer chips 250are placed into pockets 106 and the trays 10 are stacked successivelyone on top of the other. All of these operations can be done manually orwith automation, or a combination of the two.

Thus the several aforementioned objects and advantages are mosteffectively attained. Although preferred embodiments of the inventionhave been disclosed and described in detail herein, it should beunderstood that this invention is in no sense limited thereby and itsscope is to be determined by that of the appended claims.

1-18. (canceled)
 19. handling device for microelectronic assemblies,comprising: a frame including a first end portion, a second end portionspaced along a longitudinal axis from the first end portion, a firstside portion coupling the first and second end portions, and a secondside portion coupling the first and second end portions and spaced alonga lateral axis from the first side portion; an insert releasablydisposed on the frame and including a plurality of pockets, withindividual pockets positioned to releasably receive a respective one ofthe microelectronic assemblies; and a retainer positioned to secure andrelease the insert with respect to the frame.
 20. A handling device formicroelectronic assemblies, comprising: a frame being injection moldedas a unitary construction of a homogeneous material, the frame includinga first end portion; a second end portion spaced along a longitudinalaxis from the first end portion; a first side portion coupling the firstand second end portions; and a second side portion coupling the firstand second end portions and spaced along a lateral axis from the firstside portion; wherein the first end portion, the second end portion, thefirst side portion and the second side portion combine to form aplatform, form a rim surrounding the platform, and define an aperture;an insert panel being vacuum molded and removably disposed across theaperture and inside of the rim, wherein the insert panel includes aperipheral region overlying the platform; and a central region having aplurality of pockets, with individual pockets positioned to releasablyreceive a respective microelectronic assemblies; and a retainerpositioned to secure and release the insert panel and the frame, theretainer having a coupled configuration with respect to the frame tosecure the insert panel to the frame, and the retainer having adecoupled configuration with respect to the frame to release the insertpanel from the frame.